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74AVC4TD245 数据表(PDF) 3 Page - NXP Semiconductors |
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74AVC4TD245 数据表(HTML) 3 Page - NXP Semiconductors |
3 / 26 page 74AVC4TD245 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 9 December 2011 3 of 26 NXP Semiconductors 74AVC4TD245 4-bit dual supply translating transceiver; 3-state 6. Pinning information 6.1 Pinning Fig 2. Logic diagram (one 1-bit transceiver) 001aao070 VCC(A) VCC(B) Bn to next transceiver OE An DIRn (1) This is not a supply pin, the substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad however if it is soldered the solder land should remain floating or be connected to GND. Fig 3. Pin configuration SOT403-1 (TSSOP16) Fig 4. Pin configuration SOT763-1 (DHVQFN16) 74AVC4TD245 VCC(A) VCC(B) DIR1 DIR2 A1 B1 A2 B2 A3 B3 A4 B4 DIR4 DIR3 GND OE 001aao072 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 001aao071 GND(1) 74AVC4TD245 DIR4 DIR3 A4 B4 A3 B3 A2 B2 A1 B1 DIR1 DIR2 Transparent top view 7 10 6 11 5 12 4 13 3 14 2 15 terminal 1 index area |
类似零件编号 - 74AVC4TD245_15 |
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类似说明 - 74AVC4TD245_15 |
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