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IRF6893MTRPBF 数据表(PDF) 3 Page - International Rectifier |
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IRF6893MTRPBF 数据表(HTML) 3 Page - International Rectifier |
3 / 9 page IRF6893MTRPbF www.irf.com 3 Used double sided cooling , mounting pad with large heatsink. Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Notes: Ris measured at TJ of approximately 90°C. Surface mounted on 1 in. square Cu (still air). Mounted to a PCB with small clip heatsink (still air) Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air) Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 1E-005 0.0001 0.001 0.01 0.1 1 10 100 1000 t1 , Rectangular Pulse Duration (sec) 0.001 0.01 0.1 1 10 100 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc Absolute Maximum Ratings Parameter Units PD @TA = 25°C Power Dissipation W PD @TA = 70°C Power Dissipation PD @TC = 25°C Power Dissipation TP Peak Soldering Temperature °C TJ Operating Junction and TSTG Storage Temperature Range Thermal Resistance Parameter Typ. Max. Units RJA Junction-to-Ambient e ––– 60 RJA Junction-to-Ambient j 12.5 ––– RJA Junction-to-Ambient k 20 ––– °C/W RJC Junction-to-Case fl ––– 1.8 RJ-PCB Junction-to-PCB Mounted k 1.0 ––– Linear Derating Factor W/°C 0.017 270 -40 to + 150 Max. 69 2.1 1.3 |
类似零件编号 - IRF6893MTRPBF |
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类似说明 - IRF6893MTRPBF |
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