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SMLC6.5C-2 数据表(PDF) 6 Page - Protek Devices

部件名 SMLC6.5C-2
功能描述  high powered MULTI-LINE low capacitanc e TVS ARRAY
Download  9 Pages
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制造商  PROTEC [Protek Devices]
网页  http://www.protekdevices.com
标志 PROTEC - Protek Devices

SMLC6.5C-2 数据表(HTML) 6 Page - Protek Devices

  SMLC6.5C-2_12 Datasheet HTML 1Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 2Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 3Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 4Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 5Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 6Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 7Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 8Page - Protek Devices SMLC6.5C-2_12 Datasheet HTML 9Page - Protek Devices  
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Only One Name Means ProTek’Tion™
www.protekdevices.com
05105.R9 10/12
Page 6
SMLC6.5C-2 - SMLC12C-2
aPPLiCaTioN iNFoRMaTioN
FigURe 1 - BidiReCTioNaL diFFeReNTiaL PRoTeCTioN FoR T1/e1
Circuit connectivity is as follows:
• Line 1 connected to pins 1, 2, 15 and 16.
• Line 2 connected to pins 3, 4, 13 and 14.
• Line 3 connected to pins 5, 6, 11 and 12.
• Line 4 connected to pins 7, 8, 9 and 10.
CiRCUiT BoaRd ReCoMMeNdaTioNS
Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended:
• The protection device should be placed near the input terminals or connectors, the device will divert the transient current
immediately before it can be coupled into the nearby traces.
• The path length between the TVS device and the protected line should be minimized.
• All conductive loops including power and ground loops should be minimized.
• The transient current return path to ground should be kept as short as possible to reduce parasitic inductance.
• Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
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