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LTC3245 数据表(PDF) 13 Page - Linear Technology

部件名 LTC3245
功能描述  Wide VIN Range, Low Noise, 250mA Buck-Boost Charge Pump
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制造商  LINER [Linear Technology]
网页  http://www.linear.com
标志 LINER - Linear Technology

LTC3245 数据表(HTML) 13 Page - Linear Technology

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LTC3245
13
3245fa
For more information www.linear.com/LTC3245
applicaTions inForMaTion
ratherthandiscussingthespecifiedcapacitancevalue.For
example, over rated voltage and temperature conditions,
a 4.7μF, 10V, Y5V ceramic capacitor in an 0805 case may
not provide any more capacitance than a 1μF, 10V, X5R
or X7R available in the same 0805 case. In fact, over bias
and temperature range, the 1μF, 10V, X5R or X7R will
provide more capacitance than the 4.7μF, 10V, Y5V. The
capacitor manufacturer’s data sheet should be consulted
to determine what value of capacitor is needed to ensure
minimum capacitance values are met over operating
temperature and bias voltage. Below is a list of ceramic
capacitor manufacturers and how to contact them:
MANUFACTURER
WEBSITE
AVX
www.avxcorp.com
Kemet
www.kemet.com
Murata
www.murata.com
Taiyo Yuden
www.t-yuden.com
TDK
www.tdk.com
Layout Considerations
Due to the high switching frequency and transient cur-
rents produced by the LTC3245, careful board layout is
necessary for optimal performance. A true ground plane
and short connections to all capacitors will optimize
performance, reduce noise and ensure proper regulation
over all conditions.
When using the LTC3245 with an external resistor divider
it is important to minimize any stray capacitance to the
ADJ (OUTS/ADJ pin) node. Stray capacitance from ADJ
to C+ or Ccan degrade performance significantly and
should be minimized and/or shielded if necessary.
Thermal Management
TheonchippowerdissipationintheLTC3245willcausethe
junction to ambient temperature to rise at rate of 40°C/W
or more. To reduce the maximum junction temperature, a
goodthermalconnectiontothePCboardisrecommended.
Connecting the die paddle (Pin 13) with multiple vias to a
largegroundplaneunderthedevicecanreducethethermal
resistanceofthepackageandPCboardconsiderably.Poor
board layout and failure to connect the die paddle (Pin 13)
to a large ground plane can result in thermal junction to
ambient impedance well in excess of 40°C/W.
Because of the wide input operating range it is possible to
exceed the specified operating junction temperature and
even reach thermal shutdown. Figure 3 shows the avail-
able output current vs temperature to ensure the 150°C
operating junction temperature is not exceed for input
voltages less than 20V.
Figure 3 assumes worst-case operating conditions. Under
someoperatingconditionsthepartcansupplymorecurrent
than shown without exceeding the 150°C operating junc-
tion temperature. When operating outside the constraints
of Figure 3 it is the responsibility of the user to calculate
worst-caseoperatingconditions(temperatureandpower)
to make sure the LTC3245’s specified operating junction
temperature is not exceeded for extended periods of time.
The 2:1 Step-Down, 1:1 Step-Down, and 1:2 Step-Up
Charge Pump Operation sections provide equations for
calculating power dissipation (PD) in each mode.
For example, if it is determined that the maximum power
dissipation (PD) is 1.2W under normal operation, then the
junction to ambient temperature rise will be:
Junction to ambient = 1.2W • 40°C/W = 48°C
Thus,theambienttemperatureunderthisconditioncannot
exceed102°Cifthejunctiontemperatureistoremainbelow
150°Candiftheambienttemperatureexceedsabout127°C
the device will cycle in and out of the thermal shutdown.
Figure 3. Available Output Current vs Temperature
TEMPERATURE (°C)
70
0
50
150
100
250
200
300
80
3245 F03
90
100
110
130
120
150
140
VIN < 20V


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