LT1027

7

S

A

CHE

TIC

EQUIVALE T

OUTPUT CURRENT LIMIT AND

BIAS CIRCUITS NOT SHOWN

NR

GND

1027 ES

Dimensions in inches (millimeters) unless otherwise noted.

PACKAGE DESCRIPTIO

H Package

8-Lead TO-5 Metal Can (0.230 PCD)

(LTC DWG # 05-08-1321)

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of circuits as described herein will not infringe on existing patent rights.

0.050

(1.270)

MAX

0.016 – 0.021**

(0.406 – 0.533)

0.010 – 0.045*

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.230

(5.842)

TYP

0.027 – 0.045

(0.686 – 1.143)

0.028 – 0.034

(0.711 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

45

°TYP

H8 (TO-5) 0.230 PCD 1197

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

0.016 – 0.024

(0.406 – 0.610)

*

**

PIN 1