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LT1942 数据表(PDF) 15 Page - Linear Technology |
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LT1942 数据表(HTML) 15 Page - Linear Technology |
15 / 16 page LT1942 15 1942fb PACKAGE DESCRIPTIO UF Package 24-Lead Plastic QFN (4mm × 4mm) (Reference LTC DWG # 05-08-1697) 4.00 ± 0.10 (4 SIDES) NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE PIN 1 TOP MARK (NOTE 6) 0.38 ± 0.10 24 0.23 TYP (4 SIDES) 23 1 2 BOTTOM VIEW—EXPOSED PAD 2.45 ± 0.10 (4-SIDES) 0.75 ± 0.05 R = 0.115 TYP 0.25 ± 0.05 0.50 BSC 0.200 REF 0.00 – 0.05 (UF24) QFN 1103 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.70 ±0.05 0.25 ±0.05 0.50 BSC 2.45 ± 0.05 (4 SIDES) 3.10 ± 0.05 4.50 ± 0.05 PACKAGE OUTLINE Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. |
类似零件编号 - LT1942 |
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类似说明 - LT1942 |
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