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UPD16312 数据表(PDF) 16 Page - NEC |
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UPD16312 数据表(HTML) 16 Page - NEC |
16 / 20 page 16 PD16312 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in cae other soldering process is used, or in case soldering is done under different conditions. PC16312GB-3B4 Soldering process Soldering conditions Symbol Infrared ray reflow Peak package’s surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow process: 2, Exposure limit*: None IR35-00-2 VPS Peak package’s surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 2, Exposure limit*: None VP15-00-2 Wave soldering Solder temperature: 260 C or below, Flow time: 10 seconds or below Number of flow process: 1, Exposure limit*: None WS60-00-1 Partial heating method Terminal temperature: 300 C or below, Flow time 10 seconds or below, Exposure limit*: None * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method”. |
类似零件编号 - UPD16312 |
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类似说明 - UPD16312 |
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