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PD16312

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product. Please consult with our sales

offices in cae other soldering process is used, or in case soldering is done under different conditions.

PC16312GB-3B4

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 235

C or below,

Reflow time: 30 seconds or below (210

C or higher),

Number of reflow process: 2, Exposure limit*: None

IR35-00-2

VPS

Peak package’s surface temperature: 215

C or below,

Reflow time: 40 seconds or below (200

C or higher),

Number of reflow process: 2, Exposure limit*: None

VP15-00-2

Wave soldering

Solder temperature: 260

C or below,

Flow time: 10 seconds or below

Number of flow process: 1, Exposure limit*: None

WS60-00-1

Partial heating method

Terminal temperature: 300

C or below,

Flow time 10 seconds or below,

Exposure limit*: None

* Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

C and relative humidity at 65 % or less.

Note Do not apply more than a single process at once, except for “Partial heating method”.