IRF3205S datasheet(1/10 Pages) KERSEMI

部件名	IRF3205S

功能描述	Advanced Process Technology

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制造商	KERSEMI [Kersemi Electronic Co., Ltd.]

网页	http://www.kersemi.com

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IRF3205S/L

Thermal Resistance

VDSS = 55V

RDS(on) = 8.0mΩ

ID = 110A

S

D

G

The D2Pak is a surface mount power package capable of

accommodating die sizes up to HEX-4. It provides the highest power

capability and the lowest possible on-resistance in any existing surface

mount package. The D2Pak is suitable for high current applications

because of its low internal connection resistance and can dissipate up

to 2.0W in a typical surface mount application.

The through-hole version (IRF3205L) is available for low-profile

applications.

l Advanced Process Technology

l Ultra Low On-Resistance

l Dynamic dv/dt Rating

l 175°C Operating Temperature

l Fast Switching

l Fully Avalanche Rated

Description

D2Pak

IRF3205S

TO-262

IRF3205L

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case

–––

0.75

°C/W

RθJA

Junction-to-Ambient (PCB mounted, steady-state)

*

–––

40

Absolute Maximum Ratings

Parameter

Max.

Units

ID @ TC = 25°C

Continuous Drain Current, VGS @ 10V

110

ID @ TC = 100°C

Continuous Drain Current, VGS @ 10V

80

A

IDM

Pulsed Drain Current

390

PD @TC = 25°C

Power Dissipation

200

W

Linear Derating Factor

1.3

W/°C

VGS

Gate-to-Source Voltage

± 20

V

IAR

Avalanche Current

62

A

EAR

Repetitive Avalanche Energy

20

mJ

dv/dt

Peak Diode Recovery dv/dt

5.0

V/ns

TJ

Operating Junction and

-55 to + 175

TSTG

Storage Temperature Range

Soldering Temperature, for 10 seconds

300 (1.6mm from case )

°C

Mounting torque, 6-32 or M3 srew

10 lbf•in (1.1N•m)

2014-8-28

1

www.kersemi.com

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