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SMP04 数据表(PDF) 3 Page - Analog Devices |
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SMP04 数据表(HTML) 3 Page - Analog Devices |
3 / 15 page SMP04 –3– REV. D ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted) VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.7 V, 17 V VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD VOUT to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . ±20 mA (Not Short-Circuit Protected) Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD + 0.3 V Operating Temperature Range EQ, EP, ES . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Storage Temperature . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 °C Package Type JA* JC Units 16-Lead Cerdip 94 12 °C/W 16-Lead Plastic DIP 76 33 °C/W 16-Lead SO 92 27 °C/W * JA is specified for worst case mounting conditions, i.e., JA is specified for device in socket for cerdip and plastic DIP packages; JA is specified for device soldered to printed circuit board for SO package. CAUTION 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; function operation at or above this specification is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reliability. 2. Digital inputs and outputs are protected; however, permanent damage may occur on unprotected units from high energy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper antistatic handling procedures. 3. Remove power before inserting or removing units from their sockets. ORDERING GUIDE Temperature Package Package Model Range Description Options* SMP04EQ –40 °C to +85°C Cerdip-16 Q-16 SMP04EP –40 °C to +85°C PDIP-16 N-16 SMP04ES –40 °C to +85°C SO-16 R-16A *Q = Cerdip; N = Plastic DIP; R = Small Outline. PIN CONNECTIONS 16-Lead Cerdip 16-Lead Plastic DIP 16-Lead SO 14 13 12 11 16 15 10 9 8 1 2 3 4 7 6 5 TOP VIEW (Not to Scale) SMP04 NC = NO CONNECT VOUT2 VSS VOUT4 VOUT3 VDD VOUT1 VIN1 NC S/H4 VIN3 VIN4 VIN2 S/H1 S/H2 DGND S/H3 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the SMP04 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
类似零件编号 - SMP04_15 |
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类似说明 - SMP04_15 |
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