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ADP1653 数据表(PDF) 6 Page - Analog Devices

部件名 ADP1653
功能描述  Compact, High Efficiency, High Power, Flash/Torch LED Driver with Dual Interface
Download  24 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP1653 数据表(HTML) 6 Page - Analog Devices

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ADP1653
Rev. B | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD, CTRL0/SDA, CTRL1/SCL, INTF, EN,
SETI, SETT, SETF, STR, HPLED to GND
−0.3 V to +6 V
INT, ILED to GND
−0.3 V to + (VDD + 0.3 V)
LX, OUT to GND
−0.3 V to +12 V
PGND to GND
−0.3 V to +0.3 V
Operating Ambient Temperature Range
−40°C to +125°C1
Operating Junction Temperature
125°C
Storage Temperature Range
−65°C to +150°C
Soldering Conditions
JEDEC J-STD-020
1 In applications where high power dissipation and poor thermal resistance
are present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (TA(MAX)) is dependent on the maximum
operating junction temperature (TJ(MAXOP) = 125°C), the maximum power
dissipation of the device (PD(MAX)), and the junction-to-ambient thermal
resistance of the part/package in the application (θJA), using the following
equation: TA(MAX) = TJ(MAXOP) − (θJA × PD(MAX)).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to GND.
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is dependent on the
application and board layout. In applications where high maximum
power dissipation exists, attention to thermal board design is
required. The value of θJA may vary, depending on PCB material,
layout, and environmental conditions. For more information,
see the AN-772 Application Note, A Design and Manufacturing
Guide for the Lead Frame Chip Scale Package (LFCSP).
Table 4. Thermal Resistance
Parameter
Value
Unit
θJA
44
°C/W
Maximum Power Dissipation
1
W
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to
the PCB.
ESD CAUTION


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