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ADM1064 数据表(PDF) 9 Page - Analog Devices |
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ADM1064 数据表(HTML) 9 Page - Analog Devices |
9 / 32 page ADM1064 Rev. D | Page 9 of 32 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Voltage on VH Pin 16 V Voltage on VPx Pins 7 V Voltage on VXx Pins −0.3 V to +6.5 V Voltage on A0, A1 Pins −0.3 V to +7 V Voltage on REFIN, REFOUT Pins 5 V Voltage on VDDCAP, VCCP Pins 6.5 V Voltage on PDOx Pins 16 V Voltage on SDA, SCL Pins 7 V Voltage on AUX1, AUX2 Pins −0.3 V to +5 V Voltage on GND, AGND, PDOGND, REFGND Pins −0.3 V to +0.3 V Input Current at Any Pin ±5 mA Package Input Current ±20 mA Maximum Junction Temperature (TJ max) 150°C Storage Temperature Range −65°C to +150°C Lead Temperature, Soldering Vapor Phase, 60 sec 215°C ESD Rating, All Pins 2000 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA Unit 40-Lead LFCSP 25 °C/W 48-Lead TQFP 50 °C/W ESD CAUTION |
类似零件编号 - ADM1064_15 |
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类似说明 - ADM1064_15 |
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