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AD7417 数据表(PDF) 7 Page - Analog Devices |
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AD7417 数据表(HTML) 7 Page - Analog Devices |
7 / 24 page AD7416/AD7417/AD7418 Rev. I | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter Rating VDD to AGND −0.3 V to +7 V VDD to DGND −0.3 V to +7 V Analog Input Voltage to AGND AIN1 to AIN4 −0.3 V to VDD + 0.3 V Reference Input Voltage to AGND1 −0.3 V to VDD + 0.3 V Digital Input Voltage to DGND −0.3 V to VDD + 0.3 V Digital Output Voltage to DGND −0.3 V to VDD + 0.3 V Operating Temperature Range A Version −40°C to +125°C B Version −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C TSSOP, Power Dissipation 450 mW θJA Thermal Impedance 120°C/W Lead Temperature, Soldering 260°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 16-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 100°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 157°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C MSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 206°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 If the reference input voltage is likely to exceed VDD by more than 0.3 V (for example, during power-up) and the reference is capable of supplying 30 mA or more, it is recommended to use a clamping diode between the REFIN pin and the VDD pin. Figure 5 shows how the diode should be connected. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. REFIN BAT81 AD7417 VDD Figure 5. Diode Connection ESD CAUTION |
类似零件编号 - AD7417_15 |
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类似说明 - AD7417_15 |
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