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TCS3103FN 数据表(PDF) 10 Page - List of Unclassifed Manufacturers |
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TCS3103FN 数据表(HTML) 10 Page - List of Unclassifed Manufacturers |
10 / 13 page TCS3103, TCS3104 LIGHT-TO-VOLTAGE COLOR SENSOR TAOS108B − JULY 2010 9 The LUMENOLOGY r Company r r Copyright E 2010, TAOS Inc. www.taosinc.com MANUFACTURING INFORMATION The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Table 2. TCS310x Solder Reflow Profile PARAMETER REFERENCE TCS310x Average temperature gradient in preheating 2.5 °C/sec Soak time tsoak 2 to 3 minutes Time above 217 °C t1 Max 60 sec Time above 230 °C t2 Max 50 sec Time above Tpeak −10°C t3 Max 10 sec Peak temperature in reflow Tpeak 260 °C Temperature gradient in cooling Max −5 °C/sec t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (sec) Figure 9. TCS310x Solder Reflow Profile Graph |
类似零件编号 - TCS3103FN |
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类似说明 - TCS3103FN |
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