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HCPL-0466 数据表(PDF) 4 Page - Agilent(Hewlett-Packard) |
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HCPL-0466 数据表(HTML) 4 Page - Agilent(Hewlett-Packard) |
4 / 14 page 1-52 Insulation and Safety Related Specifications 8-Pin DIP Widebody (300 Mil) SO-8 (400 Mil) Parameter Symbol Value Value Value Units Conditions Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals Air Gap (External to output terminals, shortest Clearance) distance through air. Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals Tracking (External to output terminals, shortest Creepage) distance path along body. Minimum Internal 0.08 0.08 1.0 mm Through insulation distance, Plastic Gap conductor to conductor, usually (Internal Clearance) the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA 4.0 mm Measured from input terminals Tracking (Internal to output terminals, along Creepage) internal cavity. Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. Regulatory Information The devices contained in this data sheet have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. VDE Approved according to VDE 0884/06.92 (HCNW4506 and HCPL-4506 Option 060 only). BSI Certification according to BS451:1994 (BS EN60065:1994); BS EN60950:1992 (BS7002:1992) and EN41003:1993 for Class II applications (HCNW4506 only). Note: Use of nonchlorine activated fluxes is recommended. 240 ∆T = 115°C, 0.3°C/SEC 0 ∆T = 100°C, 1.5°C/SEC ∆T = 145°C, 1°C/SEC TIME – MINUTES 220 200 180 160 140 120 100 80 60 40 20 0 260 12 3 456789 10 11 12 Solder Reflow Temperature Profile |
类似零件编号 - HCPL-0466 |
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类似说明 - HCPL-0466 |
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