6

1.00 ± 0.15

(0.039 ± 0.006)

7° NOM.

12.30 ± 0.30

(0.484 ± 0.012)

0.75 ± 0.25

(0.030 ± 0.010)

11.00

(0.433)

5

6

7

8

4

3

2

1

11.15 ± 0.15

(0.442 ± 0.006)

9.00 ± 0.15

(0.354 ± 0.006)

1.3

(0.051)

12.30 ± 0.30

(0.484 ± 0.012)

6.15

(0.242)TYP.

0.9

(0.035)

PAD LOCATION (FOR REFERENCE ONLY)

1.78 ± 0.15

(0.070 ± 0.006)

4.00

(0.158)

MAX.

1.55

(0.061)

MAX.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.254

+ 0.076

- 0.0051

(0.010

+ 0.003)

- 0.002)

MAX.

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)

Note: Use of nonchlorine activated fluxes is highly recommended.

Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount

Option 300 Parts)

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12