YZP PACKAGE

Laser Marking View

Bump View

B

C

D

3

2

1

A

B

C

D

1

2

3

A

1

2

3

4

5

10

9

8

7

6

NO2

COM2

NC2

IN2

V

+

NO1

COM1

NC1

IN1

GND

1

2

3

4

5

10

9

8

7

6

NO2

COM2

NC2

IN2

NO1

COM1

NC1

IN1

GND

Exposed

Center

Pad

TS5A22362, TS5A22364

www.ti.com

SCDS261E – MARCH 2008 – REVISED MAY 2013

0.65-

Ω DUAL SPDT ANALOG SWITCHES WITH NEGATIVE SIGNALING CAPABILITY

Check for Samples: TS5A22362, TS5A22364

1

FEATURES

DRC PACKAGE

•

Specified Break-Before-Make Switching

(TOP VIEW)

•

Negative Signaling Capability: Maximum

•

Internal Shunt Switch Prevents Audible Click-

and-Pop When Switching Between Two

Sources (TS5A22364)

•

Low ON-State Resistance (0.65

Ω Typical)

•

Low Charge Injection

•

Excellent ON-State Resistance Matching

•

•

Latch-Up Performance Exceeds 100 mA Per

The exposed center pad, if used, must be

connected as a secondary GND or left

JESD 78, Class II

electrically open.

•

ESD Performance Tested Per JESD 22

–

2500-V Human-Body Model

DGS PACKAGE

(A114-B, Class II)

(TOP VIEW)

–

1500-V Charged-Device Model (C101)

–

200-V Machine Model (A115-A)

APPLICATIONS

•

Cell Phones

•

PDAs

•

Portable Instrumentation

•

Audio Routing

•

Medical Imaging

YZP PACKAGE TERMINAL ASSIGNMENTS

D

IN1

GND

IN2

C

NC1

NC2

B

COM1

COM2

A

NO1

NO2

3

2

1

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2008–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.