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SM30T30AY 数据表(PDF) 5 Page - STMicroelectronics |
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SM30T30AY 数据表(HTML) 5 Page - STMicroelectronics |
5 / 12 page DocID022065 Rev 3 5/12 SM30TY Characteristics 12 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead Figure 9. Peak forward voltage drop versus peak forward current (typical values) Figure 10. Relative variation of thermal impedance, junction to ambient, versus pulse duration I(A) FM 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 T = 150 °C j T = 25 °C j V(V) FM Z/R th(j-a) th(j-a) 0.01 0.10 1.00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Recommended pad layout Single pulse t (s) p epoxy printed board, FR4 copper thickness = 35 µm 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S (cm ) Cu 2 epoxy printed board, FR4 copper thickness = 35 µm |
类似零件编号 - SM30T30AY |
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类似说明 - SM30T30AY |
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