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LM2586S-ADJ 数据表(PDF) 6 Page - Texas Instruments

部件名 LM2586S-ADJ
功能描述  SIMPLE SWITCHER짰 3A Flyback Regulator with Shutdown
Download  38 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

LM2586S-ADJ 数据表(HTML) 6 Page - Texas Instruments

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LM2586
SNVS121D – MAY 1996 – REVISED APRIL 2013
www.ti.com
LM2586-ADJ (continued)
Symbol
Parameters
Conditions
Typical
Min
Max
Units
ICL
NPN Switch Current Limit
4.0
3.0
7.0
A
VSTH
Synchronization
FSYNC = 200 kHz
0.75
0.625/0.40
0.875/1.00
V
Threshold Voltage
VCOMP = 1V, VIN = 5V
ISYNC
Synchronization
VIN = 5V
100
200
μA
Pin Current
VCOMP = 1V, VSYNC = VSTH
VSHTH
ON/OFF Pin (Pin 1)
VCOMP = 1V
1.6
1.0/0.8
2.2/2.4
V
Threshold Voltage
(7)
ISH
ON/OFF Pin (Pin 1)
VCOMP = 1V
40
15/10
65/75
μA
Current
VSH = VSHTH
θJA
Thermal Resistance
NDZ Package, Junction to
65
Ambient (8)
θJA
NDZ Package, Junction to
45
Ambient (9)
θJC
NDZ Package, Junction to Case
2
θJA
KTW Package, Junction to
56
°C/W
Ambient (10)
θJA
KTW Package, Junction to
35
Ambient (11)
θJA
KTW Package, Junction to
26
Ambient (12)
θJC
KTW Package, Junction to Case
2
(7)
When testing the minimum value, do not sink current from this pin—isolate it with a diode. If current is drawn from this pin, the frequency
adjust circuit will begin operation (Figure 55).
(8)
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(9)
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(10) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.136 square inches (the
same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(11) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(12) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple® software.
6
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Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: LM2586


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