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EPM9560 数据表(PDF) 75 Page - Altera Corporation |
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EPM9560 数据表(HTML) 75 Page - Altera Corporation |
75 / 182 page Package Information Datasheet for Mature Altera Devices 75 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 160-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in inches. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference G Package Acronym PGA Leadframe Material Alloy 42 Lead Finish Gold Over Nickel Plate JEDEC Outline Reference MO-067 Variation: AG Lead Coplanarity N/A Weight 19.9 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Symbol Inches Min. Nom. Max. A 0.160 0.190 0.220 A1 0.050 TYP A2 0.120 0.140 0.160 D 1.540 1.560 1.580 E 1.540 1.560 1.580 L 0.130 TYP b 0.016 0.018 0.020 e 0.100 BSC |
类似零件编号 - EPM9560 |
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类似说明 - EPM9560 |
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