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EP2SGX60 数据表(PDF) 16 Page - Altera Corporation |
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EP2SGX60 数据表(HTML) 16 Page - Altera Corporation |
16 / 182 page 16 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation ACEX 1K Devices Table 17 lists the device name, package type, and number of pins for the ACE 1K device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. EP20K200 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 EP20K300 FBGA, Wire Bond, Option 2 672 EP20K400 BGA, Wire Bond, Option 3 652 PGA, Wire Bond 655 FBGA, Flip Chip, Option 1 672 Table 16. APEX 20K Devices (Part 2 of 2) Device Package Pins Table 17. ACEX 1K Devices Device Package Pins EP1K10 TQFP, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 EP1K30 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 EP1K50 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 FBGA, Wire Bond, Option 2 484 EP1K100 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 FBGA, Wire Bond, Option 2 484 |
类似零件编号 - EP2SGX60 |
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类似说明 - EP2SGX60 |
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