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EP2SGX60 数据表(PDF) 14 Page - Altera Corporation |
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EP2SGX60 数据表(HTML) 14 Page - Altera Corporation |
14 / 182 page 14 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation EP20K100E FBGA, Wire Bond 144 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 FBGA, Wire Bond, Option 1 324 BGA, Wire Bond 356 EP20K160E TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 EP20K200E PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond 356 FBGA, Wire Bond, Option 2 484 BGA, Wire Bond, Option 2 652 FBGA, Wire Bond, Option 2 672 EP20K300E PQFP, Wire Bond 240 BGA, Wire Bond, Option 2 652 FBGA, Wire Bond, Option 2 672 EP20K400E BGA, Wire Bond, Option 3 652 FBGA, Flip Chip, Option 1 672 EP20K600E BGA, Wire Bond, Option 3 652 FBGA, Flip Chip, Option 1 672 FBGA, Flip Chip, Option 1 1020 EP20K1000E BGA, Flip Chip 652 FBGA, Flip Chip, Option 1 672 FBGA, Flip Chip, Option 1 1020 EP20K1500E BGA, Flip Chip 652 FBGA, Flip Chip, Option 1 1020 Table 14. APEX 20KE Devices (Part 2 of 2) Device Package Pins |
类似零件编号 - EP2SGX60 |
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类似说明 - EP2SGX60 |
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