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LM3642 数据表(PDF) 4 Page - Texas Instruments |
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LM3642 数据表(HTML) 4 Page - Texas Instruments |
4 / 26 page LM3642 SNVS891F – SEPTEMBER 2012 – REVISED JANUARY 2014 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) (3) VIN, VSW,VOUT −0.3V to 6V VSCL, VSDA, VSTROBE, VTX, VLED −0.3V to the lesser of (VIN+0.3V) w/ 6V max Continuous Power Dissipation (4) Internally Limited Junction Temperature (TJ-MAX) +150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering) (5) ESD Rating - Human Body Model (6) 2 kV (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply verified performance limits. For verified performance limits and associated test conditions, see the Electrical Characteristics table. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=+150°C (typ.) and disengages at TJ = +135°C (typ.). Thermal shutdown is verified by design. (5) For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level chip Scale Package (AN-1112) (6) The human body model is a 100pF capacitor discharged through 1.5k Ω resistor into each pin. (MIL-STD-883 3015.7). OPERATING RATINGS (1) (2) VIN 2.5V to 5.5V Junction Temperature (TJ) −40°C to +125°C Ambient Temperature (TA) (3) −40°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply verified performance limits. For verified performance limits and associated test conditions, see the Electrical Characteristics table. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES Thermal Junction-to-Ambient Resistance ( θJA) 60°C/W (1) (1) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5 oz/1oz/1oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. 4 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: LM3642 |
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类似说明 - LM3642 |
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