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LM1117-2.5 数据表(PDF) 8 Page - Cystech Electonics Corp. |
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LM1117-2.5 数据表(HTML) 8 Page - Cystech Electonics Corp. |
8 / 8 page CYStech Electronics Corp. Spec. No. : C506J3 Issued Date : 2007.07.10 Revised Date :2011.08.11 Page No. : 8/8 LM1117-XXXJ3 CYStek Product Specification TO-252AA Dimension Inches Millimeters Marking: Style: Pin 1.Vin 2.Ground 3.Vout 4.Vin 3-Lead TO-252AA Plastic Surface Mount Package CYStek Package Code: J3 Device Name Date Code 1117□□□ □□□□ 1 2 3 4 1.5V→-15 1.8V→-18 2.5V→-25 3.3V→-33 5.0V→-50 ADJ→ blank Inches Millimeters DIM Min. Max. Min. Max. DIM Min. Max. Min. Max. A 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 A1 0.000 0.005 0.000 0.127 e1 0.172 0.188 4.372 4.772 B 0.039 0.048 0.990 1.210 H 0.163 REF 4.140 REF b 0.026 0.034 0.660 0.860 K 0.190 REF 4.830 REF b1 0.026 0.034 0.660 0.860 L 0.386 0.409 9.800 10.400 C 0.018 0.023 0.460 0.580 L1 0.114 REF 2.900 REF C1 0.018 0.023 0.460 0.580 L2 0.055 0.067 1.400 1.700 D 0.256 0.264 6.500 6.700 L3 0.024 0.039 0.600 1.000 D1 0.201 0.215 5.100 5.460 P 0.026 REF 0.650 REF E 0.236 0.244 6.000 6.200 V 0.211 REF 5.350 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. |
类似零件编号 - LM1117-2.5 |
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类似说明 - LM1117-2.5 |
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