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BAR40N3 数据表(PDF) 4 Page - Cystech Electonics Corp. |
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BAR40N3 数据表(HTML) 4 Page - Cystech Electonics Corp. |
4 / 7 page CYStech Electronics Corp. Spec. No. : C302N3 Issued Date : 2011.06.27 Revised Date : 2012.02.07 Page No. : 4/7 BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 5 +1/-1 seconds 260 +0/-5 °C Recommended temperature profile for IR reflow Pb-free Assembly Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3 °C/second max. 3 °C/second max. (Tsmax to Tp) Preheat 100 °C 150 °C −Temperature Min(TS min) −Temperature Max(TS max) 150 °C 200 °C −Time(ts min to ts max) 60-120 seconds 60-180 seconds Time maintained above: −Temperature (TL) 183 °C 217 °C − Time (tL) 60-150 seconds 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5 °C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Time 25 °C to peak temperature Note : All temperatures refer to topside of the package, measured on the package body surface. |
类似零件编号 - BAR40N3 |
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类似说明 - BAR40N3 |
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