www.clare.com

6

TS112N

Rev. 2

Dimensions

mm

(inches)

Mechanical Dimensions

PC Board Pattern

(Top View)

2.540

± .127

(.100

± .005)

5.080

± .127

(.200

± .005)

1.193

(.047)

.787

(.031)

.20

± .025

(.008

± .001)

2.54 TYP.

(.100 TYP.)

2.18 MAX.

(.086)

1.01

± .025

(.040

± .001)

3.81

± .05

(.150

± .002)

6.09

± .10

(.240

± .004)

.38 x 45

°

(.015 x 45

°)

.38 TYP.

(.015 TYP.)

9.34

± .20

(.368

± .008)

8 Pin SOIC Narrow (“N” Suffix)

7.49

(.295)

2.00

(.079)

12.09

(.476)

1.75

(.069)

3.99

(.157)

1.50

(.059)

6.73

(.265)

.41

(.016)

2.30

(.091)

2.70

(.106)

Top Cover

Tape

2.01

(.079)

11.99

(.472)

User Direction of Feed

.05R TYP.

16.00

(.630)

10.30

(.406)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

.10 MAX.

(.004)

6.80

(.268)

6.50

(.256)

3.00

(.118)

1.55

± .102

(.061

± .004)

330.2 DIA.

(13.00)

Tape and Reel Packaging for 8 and 16 Pin Narrow SOIC Package

1