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CS8271YDR8 数据表(PDF) 6 Page - Cherry Semiconductor Corporation |
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CS8271YDR8 数据表(HTML) 6 Page - Cherry Semiconductor Corporation |
6 / 6 page Thermal Data 8L 8L SOIC PDIP RQJC typ 45 52 ûC/W RQJA typ 165 100 ûC/W D Lead Count Metric English Max Min Max Min 8L SOIC 5.00 4.80 .197 .189 8L PDIP 10.16 9.02 .400 .355 6 Rev. 3/26/97 Part Number Description CS8271YD8 8L SOIC CS8271YDR8 8L SOIC (tape & reel) CS8271YN8 8L PDIP Package Specification Ordering Information PACKAGE DIMENSIONS IN mm (INCHES) PACKAGE THERMAL DATA © 1999 Cherry Semiconductor Corporation Cherry Semiconductor Corporation reserves the right to make changes to the specifications without notice. Please contact Cherry Semiconductor Corporation for the latest available information. Surface Mount Narrow Body (D); 150 mil wide Plastic DIP (N); 300 mil wide 0.39 (.015) MIN. 2.54 (.100) BSC 1.77 (.070) 1.14 (.045) D Some 8 and 16 lead packages may have 1/2 lead at the end of the package. All specs are the same. .203 (.008) .356 (.014) REF: JEDEC MS-001 3.68 (.145) 2.92 (.115) 8.26 (.325) 7.62 (.300) 7.11 (.280) 6.10 (.240) .356 (.014) .558 (.022) 1.27 (.050) BSC 0.51 (.020) 0.33 (.013) 6.20 (.244) 5.80 (.228) 4.00 (.157) 3.80 (.150) 1.57 (.062) 1.37 (.054) D 0.25 (0.10) 0.10 (.004) 1.75 (.069) MAX 1.27 (.050) 0.40 (.016) REF: JEDEC MS-012 0.25 (.010) 0.19 (.008) |
类似零件编号 - CS8271YDR8 |
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类似说明 - CS8271YDR8 |
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