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CS8129YDWR16 数据表(PDF) 7 Page - Cherry Semiconductor Corporation |
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CS8129YDWR16 数据表(HTML) 7 Page - Cherry Semiconductor Corporation |
7 / 8 page 7 Application Notes: continued A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RQJA. RQJA = RQJC + RQCS + RQSA (3) where RQJC = the junctionÐtoÐcase thermal resistance, RQCS = the caseÐtoÐheatsink thermal resistance, and RQSA = the heatsinkÐtoÐambient thermal resistance. RQJC appears in the package section of the data sheet. Like RQJA, it too is a function of package type. RQCS and RQSA are functions of the package type, heatsink and the inter- face between them. These values appear in heat sink data sheets of heat sink manufacturers. Heat Sinks |
类似零件编号 - CS8129YDWR16 |
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类似说明 - CS8129YDWR16 |
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