CYStech Electronics Corp.

Spec. No. : C854K3

Issued Date : 2012.10.08

Revised Date :

Page No. : 6/6

BTB1236AK3

CYStek Product Specification

TO-92L Dimension

*: Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.146

0.161

3.700

4.100

E

0.307

0.323

7.800

8.200

A1

0.050

0.062

1.280

1.580

e

*0.05

*1.270

b

0.014

0.022

0.350

0.550

e1

0.096

0.104

2.440

2.640

b1

0.024

0.031

0.600

0.800

L

0.543

0.559

13.800

14.200

c

0.014

0.018

0.350

0.450

ϕ

-

0.063

-

1.600

D

0.185

0.201

4.700

5.100

h

0.000

0.012

0.000

0.300

D1

0.157

-

4.000

-

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

□□

Marking:

Style: Pin 1.Emitter 2.Collector 3.Base

3-Lead TO-92L Plastic Package

CYStek Package Code: K3

Product Name

Date Code: Year+Month

Year: 7→2007, 8→2008

Month: 1→1, 2→2, ‧‧‧,

9→9, A→10, B→11, C→12

B1236