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TLP372 数据表(PDF) 2 Page - Toshiba Semiconductor |
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TLP372 数据表(HTML) 2 Page - Toshiba Semiconductor |
2 / 8 page TLP371,TLP372 2007-10-01 2 Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Forward current IF 60 mA Forward current derating (Ta ≥ 39°C) ΔIF / °C −0.7 mA / °C Peak forward current (100μs pulse, 100pps) IFP 1 A Reverse voltage VR 5 V Junction temperature Tj 125 °C Collector −emitter voltage VCEO 300 V Collector −base voltage (TLP371) VCBO 300 V Emitter −collector voltage VECO 0.3 V Emitter −base voltage (TLP371) VEBO 7 V Collector current IC 150 mA Power dissipation PC 300 mW Power dissipation derating (Ta ≥ 25°C) ΔPC / °C −3.0 mW / °C Junction temperature Tj 125 °C Storage temperature range Tstg −55~125 °C Operating temperature range Topr −55~100 °C Lead soldering temperature (10 s) Tsold 260 °C Total package power dissipation PT 350 mW Total package power dissipation derating (Ta ≥ 25°C) ΔPT / °C −3.5 mW / °C Isolation voltage (AC, 1min., R.H. ≤ 60%) (Note 1) BVS 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4,5 and 6 shorted together. Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Supply voltage VCC ― ― 200 V Forward current IF ― 16 25 mA Collector current IC ― ― 120 mA Operating temperature Topr −25 ― 85 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. |
类似零件编号 - TLP372 |
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类似说明 - TLP372 |
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