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ADG733BRUZ 数据表(PDF) 11 Page - Analog Devices |
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ADG733BRUZ 数据表(HTML) 11 Page - Analog Devices |
11 / 12 page REV. A ADG733/ADG734 –11– 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters 16 9 8 1 PIN 1 SEATING PLANE 8 0 4.50 4.40 4.30 6.40 BSC 5.10 5.00 4.90 0.65 BSC 0.15 0.05 1.20 MAX 0.20 0.09 0.75 0.60 0.45 0.30 0.19 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153AB OUTLINE DIMENSIONS 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20) Dimensions shown in millimeters 20 1 11 10 6.40 BSC 4.50 4.40 4.30 PIN 1 6.60 6.50 6.40 SEATING PLANE 0.15 0.05 0.30 0.19 0.65 BSC 1.20 MAX 0.20 0.09 0.75 0.60 0.45 8 0 COMPLIANT TO JEDEC STANDARDS MO-153AC COPLANARITY 0.10 16-Lead SOIC, 0.025 Lead Pitch [QSOP] (RQ-16) Dimensions shown in inches 16 9 8 1 0.197 0.189 0.236 BSC PIN 1 0.154 BSC SEATING PLANE 0.010 0.004 0.012 0.008 0.025 BSC 0.010 0.006 0.050 0.016 8 0 COPLANARITY 0.004 0.065 0.049 0.069 0.053 COMPLIANT TO JEDEC STANDARDS MO-137AB |
类似零件编号 - ADG733BRUZ |
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