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BAT5409KFILM 数据表(PDF) 4 Page - STMicroelectronics |
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BAT5409KFILM 数据表(HTML) 4 Page - STMicroelectronics |
4 / 13 page Characteristics BAT54 4/13 Doc ID 5505 Rev 10 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 7. Thermal resistance junction to ambient versus copper surface under each lead (SOD-323) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-323) 200 300 400 500 600 0 5 10 15 20 25 30 35 40 45 50 R th(j-a)(°C/W) Epoxy FR4 e CU=35 µm SCU(mm²) 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Z th(j-a)/Rth(j-a) Single pulse SOD323 Epoxy FR4 S CU=2.25 mm² e CU=35 µm tP(s) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (SOT-23) Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-523) 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 Z th(j-a)/Rth(j-a) Alumine substrate 10 x 8 x 0.5 mm Single pulse SOT23 tP(s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Z th(j-a)/Rth(j-a) Single pulse SOD523 Epoxy FR4 e CU=35 µm tP(s) 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Z th(j-a)/Rth(j-a) Single pulse SOT666 Epoxy FR4 e CU=35 µm tP(s) |
类似零件编号 - BAT5409KFILM |
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类似说明 - BAT5409KFILM |
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