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AD6645ASQ-80 数据表(PDF) 7 Page - Analog Devices |
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AD6645ASQ-80 数据表(HTML) 7 Page - Analog Devices |
7 / 24 page AD6645 Rev. D | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Electrical AVCC Voltage 0 V to 7 V DVCC Voltage 0 V to 7 V Analog Input Voltage 0 V to AVCC Analog Input Current 25 mA Digital Input Voltage 0 V to AVCC Digital Output Current 4 mA Environmental Operating Temperature Range (Ambient) AD6645-80 −40°C to +85°C AD6645-105 −10°C to +85°C Maximum Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The heat sink of the AD6645ASVZ, 52-lead TQFP_EP (SV-52-1) package must be soldered to the PCB GND plane to meet thermal specifications. Table 6. Thermal Characteristics Package Type Rating 52-Lead TQFP_EP θJA (0 m/sec airflow)1, 2, 3 23°C/W, soldered heat sink θJMA (1.0 m/sec airflow)2, 3, 4, 5 17°C/W, soldered heat sink θJC6, 7 2°C/W, soldered heat sink 52-Lead LQFP_PQ4 θJA (0 m/sec airflow)1, 2, 3 30°C/W, unsoldered heat sink θJMA (1.0 m/sec airflow)2, 3, 4, 5 24°C/W, unsoldered heat sink θJA (0 m/sec airflow)1, 2, 3 23°C/W, soldered heat sink θJMA (1.0 m/sec airflow)2, 3, 4, 5 17°C/W, soldered heat sink θJC6, 7 2°C/W 1 Per JEDEC JESD51-2 (heat sink soldered to PCB). 2 2S2P JEDEC test board. 3 Values of θ JA are provided for package comparison and PCB design considerations. 4 Per JEDEC JESD51-6 (heat sink soldered to PCB). 5 Airflow increases heat dissipation, effectively reducing θJA. Furthermore, the more metal that is directly in contact with the package leads from metal traces, throughholes, ground, and power planes, the more θJA is reduced. 6 Per MIL-STD-883, Method 1012.1. 7 Values of θ JC are provided for package comparison and PCB design considerations when an external heat sink is required. Values of θJA are provided for package comparison and PCB design considerations. θJA can be used for a first-order approximation of TJ by the equation TJ = TA + (θJA × PD) where: TA is the ambient temperature (°C). PD is the power dissipation (W). EXPLANATION OF TEST LEVELS I. 100% production tested. II. 100% production tested at 25°C and guaranteed by design and characterization at temperature extremes. III. Sample tested only. IV. Parameter is guaranteed by design and characterization testing. V. Parameter is a typical value only. ESD CAUTION |
类似零件编号 - AD6645ASQ-80 |
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类似说明 - AD6645ASQ-80 |
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