SI3457DV datasheet(2/5 Pages) FAIRCHILD

部件名	SI3457DV

功能描述	Single P-Channel Logic Level PowerTrench MOSFET

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制造商	FAIRCHILD [Fairchild Semiconductor]

网页	http://www.fairchildsemi.com

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2 / 5 page

Si3457DV Rev A(W)

Electrical Characteristics

T

A

= 25°C unless otherwise noted

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

Off Characteristics

BVDSS

Drain–Source Breakdown Voltage

VGS = 0 V, ID = –250

µA

–30

V

∆BVDSS

∆T

J

Breakdown Voltage Temperature

Coefficient

ID = –250

µA,Referenced to 25°C

–22

mV/

°C

IDSS

Zero Gate Voltage Drain Current

VDS = –24 V,

VGS = 0 V

–1

µA

IGSSF

Gate–Body Leakage, Forward

VGS = 25 V,

VDS = 0 V

100

nA

IGSSR

Gate–Body Leakage, Reverse

VGS = –25 V

VDS = 0 V

–100

nA

On Characteristics

(Note 2)

VGS(th)

Gate Threshold Voltage

VDS = VGS, ID = –250

µA

–1

–1.8

–3

V

∆VGS(th)

∆T

J

Gate Threshold Voltage

Temperature Coefficient

ID = –250

µA,Referenced to 25°C

4

mV/

°C

RDS(on)

Static Drain–Source

On–Resistance

VGS = –10 V,

ID = –4 A

VGS = –4.5 V,

ID = –3.4 A

VGS = –10 V, ID = –4 A;TJ=125

°

44

67

60

50

75

70

m

Ω

ID(on)

On–State Drain Current

VGS = –10 V,

VDS = –5 V

–20

A

gFS

Forward Transconductance

VDS = –5 V,

ID = –4 A

8.4

S

Dynamic Characteristics

Ciss

Input Capacitance

470

pF

Coss

Output Capacitance

126

pF

Crss

Reverse Transfer Capacitance

VDS = –15 V,

V GS = 0 V,

f = 1.0 MHz

61

pF

Switching Characteristics (Note 2)

td(on)

Turn–On Delay Time

7

14

ns

tr

Turn–On Rise Time

12

22

ns

td(off)

Turn–Off Delay Time

16

29

ns

tf

Turn–Off Fall Time

VDD = –15 V,

ID = –1 A,

VGS = –10 V,

RGEN = 6

Ω

6

12

ns

Qg

Total Gate Charge

6

8.1

nC

Qgs

Gate–Source Charge

2.1

nC

Qgd

Gate–Drain Charge

VDS = –15 V,

ID = –4 A,

VGS = –.5 V

2

nC

Drain–Source Diode Characteristics and Maximum Ratings

IS

Maximum Continuous Drain–Source Diode Forward Current

–1.3

A

VSD

Drain–Source Diode Forward

Voltage

VGS = 0 V,

IS = –1.3 A (Note 2)

–0.77

–1.2

V

Notes:

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of

the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.

a)

78°C/W when

mounted on a 1in

2 pad

of 2 oz copper

b)

156°C/W when mounted

on a minimum pad of 2 oz

copper

Scale 1 : 1 on letter size paper

2. Pulse Test: Pulse Width < 300

µs, Duty Cycle < 2.0%

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