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LM2990S-5.0 数据表(PDF) 2 Page - Texas Instruments |
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LM2990S-5.0 数据表(HTML) 2 Page - Texas Instruments |
2 / 20 page LM2990 SNVS093D – JUNE 1999 – REVISED APRIL 2013 www.ti.com Connection Diagrams Front View Figure 1. 3-Lead TO-220 Package See Package Number NDE0003B Top View Side View Figure 2. Surface-Mount DDPAK/TO-263 Package Figure 3. Surface-Mount DDPAK/TO-263 Package See Package Number KTT0003B See Package Number KTT0003B Top View Top View Figure 4. 16-Lead CDIP Package Figure 5. 16-Lead CLGA Package See Package Number NFE0016A See Package Number NAC0016A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Input Voltage −26V to +0.3V ESD Susceptibility(3) 2 kV Power Dissipation(4) Internally Limited Junction Temperature (TJmax) 125°C Storage Temperature −65°C to +150°C TO-220 (T), Wave 260°C, 10 sec Soldering Temperature DDPAK/TO-263 (S) 235°C, 30 sec (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Human body model, 100 pF discharged through a 1.5 k Ω resistor. (4) The maximum power dissipation is a function of TJmax, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 125°C, and the LM2990 will eventually go into thermal shutdown at a TJ of approximately 160°C. For the LM2990, the junction-to-ambient thermal resistance, is 53°C/W, 73°C/W for the DDPAK/TO-263, and the junction-to-case thermal resistance is 3°C. If the DD[AK/TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2990 |
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