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AD7564ARZ-B 数据表(PDF) 6 Page - Analog Devices |
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AD7564ARZ-B 数据表(HTML) 6 Page - Analog Devices |
6 / 17 page REV. AD7564 –6– ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V IOUT1 to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V IOUT2 to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V VRFB, VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . .± 15 V Input Current to Any Pin Except Supplies 2 . . . . . . . . ±10 mA Operating Temperature Range Commercial Plastic (A, B Versions). . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C DIP Package, Power Dissipation . . . . . . . . . . . . . . . . . 875 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 75 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . 260 °C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 75 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . 260 °C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . +220 °C SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . 900 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 100 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up. PIN CONFIGURATION DIP, SOIC and SSOP Packages NC = NO CONNECT DGND I OUT2 C I OUT2 B AGND R FBC V REF C I OUT2 D R FB B V REF B I OUT2 A V DD I OUT1 C NC I OUT1 B I OUT1 D I OUT1 A R FBD R FB A V REF D V REF A SDOUT A0 CLR A1 LDAC O CLKIN FSIN SDIN 13 18 1 2 28 27 5 6 7 24 23 22 3 4 26 25 821 920 10 19 11 11 12 17 16 14 15 TOP VIEW (Not to Scale) AD7564 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7564 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE B |
类似零件编号 - AD7564ARZ-B |
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类似说明 - AD7564ARZ-B |
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