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AD8012AR-REEL 数据表(PDF) 5 Page - Analog Devices |
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AD8012AR-REEL 数据表(HTML) 5 Page - Analog Devices |
5 / 17 page REV. B –4– AD8012 MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8012 is limited by the associated rise in junction temperature. The maxi- mum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately +150 °C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175 °C for an extended period can result in device failure. The output stage of the AD8012 is designed for maximum load current capability. As a result, shorting the output to common can cause the AD8012 to source or sink 500 mA. To ensure proper operation, it is necessary to observe the maximum power derating curves. Direct connection of the output to either power supply rail can destroy the device. AMBIENT TEMPERATURE – C –50 0 TJ = 150 C 2.0 1.5 1.0 8-LEAD SOIC PACKAGE –40 –30 010 20 3040 50 6070 80 90 8-LEAD MSOP 0.5 –20 –10 Figure 3. Plot of Maximum Power Dissipation vs. Temperature for AD8012 0.1 F 0.1 F 10 F 10 F RL VIN VOUT 750 750 49.9 +VS –VS + + Test Circuit 1. Gain = +2 0.1 F 0.1 F 10 F 10 F RL VIN VOUT 750 750 53.6 +VS –VS + + Test Circuit 2. Gain = –1 Test Circuits |
类似零件编号 - AD8012AR-REEL |
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类似说明 - AD8012AR-REEL |
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