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AD7714AR-3 数据表(PDF) 8 Page - Analog Devices

部件名 AD7714AR-3
功能描述  3 V/5 V, CMOS, 500 mu A Signal Conditioning ADC
Download  40 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

AD7714AR-3 数据表(HTML) 8 Page - Analog Devices

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AD7714
REV. C
–8–
DIP and SOIC/TSSOP
ABSOLUTE MAXIMUM RATINGS*
(TA = +25
°C unless otherwise noted)
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
Reference Input Voltage to AGND . . . –0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V
Operating Temperature Range
Commercial (A Version) . . . . . . . . . . . . . . . –40
°C to +85°C
Extended (Y Version) . . . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105
°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +260
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 109
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 128
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may still
occur on these devices if they are subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS
SSOP
SCLK
MCLK IN
DGND
DVDD
SYNC
AIN1
DRDY
CS
AGND
MCLK OUT
POL
DIN
DOUT
AIN2
AIN6
AIN3
AIN5
AIN4
STANDBY
AVDD
TOP VIEW
(Not to Scale)
AD7714
RESET
REF IN(+)
REF IN(–)
BUFFER
NC = NO CONNECT
SCLK
MCLK IN
DGND
DVDD
SYNC
RESET
NC
DRDY
CS
NC
MCLK OUT
POL
DIN
DOUT
NC
NC
AIN1
AGND
AIN2
AIN6
AIN3
AIN5
AIN4
REF IN(+)
STANDBY
REF IN(–)
AVDD
BUFFER
TOP VIEW
(Not to Scale)
AD7714
WARNING!
ESD SENSITIVE DEVICE


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