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ADG731BCP 数据表(PDF) 6 Page - Analog Devices

部件名 ADG731BCP
功能描述  16-/32-Channel, Serially Controlled 4, 1.8 V to 5.5 V, 2.5 V, Analog Multiplexers
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADG731BCP 数据表(HTML) 6 Page - Analog Devices

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REV. A
–6–
ADG725/ADG731
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG725/ADG731 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C, unless otherwise noted.)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to –7 V
Analog Inputs
2 . . . . . . . . . . . . . . V
SS – 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Digital Inputs
2 . . . . . . . . . . . . . . . . . . –0.3 V to V
DD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
Thermal Impedance (4-Layer Board)
48-lead LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
°C/W
48-lead TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . 54.6
°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2 Overvoltages at SCLK,
SYNC, DIN, S, or D will be clamped by internal diodes.
Current should be limited to the maximum ratings given.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG725BCP
–40
oC to +85oCLead Frame Chip-Scale Package (LFCSP)
CP-48
ADG725BCP-REEL
–40
oC to +85oCLead Frame Chip-Scale Package (LFCSP)
CP-48
ADG725BCP-REEL7
–40
oC to +85oCLead Frame Chip-Scale Package (LFCSP)
CP-48
ADG725BSU
–40
oC to +85oCThin Plastic Quad Flat Package (TQFP)
SU-48
ADG725BSU-REEL
–40
oC to +85oCThin Plastic Quad Flat Package (TQFP)
SU-48
ADG731BCP
–40
oC to +85oCLead Frame Chip-Scale Package (LFCSP)
CP-48
ADG731BCP-REEL
–40
oC to +85oCLead Frame Chip-Scale Package (LFCSP)
CP-48
ADG731BCP-REEL7
–40
oC to +85oCLead Frame Chip-Scale Package (LFCSP)
CP-48
ADG731BSU
–40
oC to +85oCThin Plastic Quad Flat Package (TQFP)
SU-48
ADG731BSU-REEL
–40
oC to +85oCThin Plastic Quad Flat Package (TQFP)
SU-48


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