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BU3EUA3WNVX-TL 数据表(PDF) 9 Page - Rohm

部件名 BU3EUA3WNVX-TL
功能描述  Versatile Package FULL CMOS LDO Regulator
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制造商  ROHM [Rohm]
网页  http://www.rohm.com
标志 ROHM - Rohm

BU3EUA3WNVX-TL 数据表(HTML) 9 Page - Rohm

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TSZ02201-0RBR0A300040-1-2
TSZ22111・15・001
9/11
21.MAR.2013.Rev.003
BUxxUA3WNVX series
Datasheet
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage
VOUT: Output voltage
IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board
Evaluation Board 1
Layout of Board for
Measurement
IC
Implementation
Position
Top Layer (Top View)
Top Layer (Top View)
Bottom Layer (Top View)
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Double-side board)
Glass epoxy resin (Double-side board)
Board Size
70 mm x 70 mm x 1.6 mm
40 mm x 40 mm x 1.6 mm
Wiring
Rate
Top layer
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Bottom
layer
Metal (GND) wiring rate: Approx. 50%
Metal (GND) wiring rate: Approx. 50%
Through Hole
Diameter 0.5mm x 6 holes
Diameter 0.5mm x 25 holes
Power Dissipation
0.56W
0.39W
Thermal Resistance
θja=178.6°C/W
θja=256.4°C/W
* Please design the margin so that
PMAX becomes is than Pd (PMAX
<Pd)
within the usage temperature range
Fig. 23
SSON004X1010
Power dissipation heat reduction characteristics (Reference)
0
0.1
0.2
0.3
0.4
0.5
0.6
0
25
50
75
100
125
Ta [
℃]
0.56W
85
0.39W


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