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EPM7256AE 数据表(PDF) 83 Page - Altera Corporation |
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EPM7256AE 数据表(HTML) 83 Page - Altera Corporation |
83 / 182 page Package Information Datasheet for Mature Altera Devices 83 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 208-Pin Power Quad Flat Pack (RQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference R Package Acronym RQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-029 Variation: FA-1 Lead Coplanarity 0.003 inches (0.08mm) Weight 11.0 g (Typ.) or 6.4 g (Typ.) (1) Moisture Sensitivity Level Printed on moisture barrier bag Note: (1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized aluminum). Refer to PCN1002. Package Outline Dimension Table Symbol Millimeters Min. Nom. Max. A — — 4.10 A1 0.25 — 0.50 A2 3.20 3.40 3.60 D 30.60 BSC D1 28.00 BSC E 30.60 BSC E1 28.00 BSC L 0.45 0.60 0.75 L1 1.30 REF S 0.20 — — b 0.17 — 0.27 c 0.09 — 0.20 e 0.50 BSC 0 3.5 8 |
类似零件编号 - EPM7256AE |
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类似说明 - EPM7256AE |
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