数据搜索系统,热门电子元器件搜索 |
|
EPM7064AE 数据表(PDF) 97 Page - Altera Corporation |
|
EPM7064AE 数据表(HTML) 97 Page - Altera Corporation |
97 / 182 page Package Information Datasheet for Mature Altera Devices 97 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1 ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference F Package Acronym FBGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAG-1 Lead Coplanarity 0.008 inches (0.20mm) Weight 1.4 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Symbol Millimeters Min. Nom. Max. A — — 2.20 A1 0.30 — — A2 — — 1.80 A3 0.70 REF D 19.00 BSC E 19.00 BSC b 0.50 0.60 0.70 e 1.00 BSC |
类似零件编号 - EPM7064AE |
|
类似说明 - EPM7064AE |
|
|
链接网址 |
隐私政策 |
ALLDATASHEETCN.COM |
ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |