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EPM7064B 数据表(PDF) 12 Page - Altera Corporation |
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EPM7064B 数据表(HTML) 12 Page - Altera Corporation |
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12 / 182 page  12 Package Information Datasheet for Mature Altera Devices Device and Package Cross Reference Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation HardCopy APEX Devices Table 12 lists the device name, package type, and number of pins for the HardCopy APEX device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. Table 12. HardCopy APEX Devices Device Package Pins HC20K400 BGA, Wire Bond, Option 3 652 HC20K600 BGA, Wire Bond, Option 3 652 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672 |
类似零件编号 - EPM7064B |
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类似说明 - EPM7064B |
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