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EPM7064B 数据表(PDF) 69 Page - Altera Corporation |
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EPM7064B 数据表(HTML) 69 Page - Altera Corporation |
69 / 182 page Package Information Datasheet for Mature Altera Devices 69 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference E Package Acronym EQFP Leadframe Material Copper Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: BFB Lead Coplanarity 0.003 inches (0.08mm) Weight 1.1 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Symbol Millimeters Min. Nom. Max. A — — 1.60 A1 0.05 — 0.15 A2 1.35 1.40 1.45 D 22.00 BSC D1 20.00 BSC D2 4.00 — — E 22.00 BSC E1 20.00 BSC E2 4.00 — — L 0.45 0.60 0.75 L1 1.00 REF S 0.20 — — b 0.17 0.22 0.27 c 0.09 — 0.20 e 0.50 BSC 0 3.5 7 |
类似零件编号 - EPM7064B |
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类似说明 - EPM7064B |
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