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EPM7064B 数据表(PDF) 57 Page - Altera Corporation |
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EPM7064B 数据表(HTML) 57 Page - Altera Corporation |
57 / 182 page Package Information Datasheet for Mature Altera Devices 57 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 64-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M – 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference E Package Acronym EQFP Leadframe Material Copper Lead Finish (plating) Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn JEDEC Outline Reference MS-026 Variation: ABD-HD Lead Coplanarity 0.003 inch (0.08 mm) Weight 0.15 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Symbol Millimeters Min. Nom. Max. A — — 1.20 A1 0.05 — 0.15 A2 0.95 1.00 1.05 D 9.00 BSC D1 7.00 BSC D2 3.50 4.50 5.50 E 9.00 BSC E1 7.00 BSC E2 3.50 4.50 5.50 L 0.45 0.60 0.75 L1 1.00 REF S 0.20 —— b 0.13 0.18 0.23 c 0.09 — 0.20 e 0.40 BSC 0° 3.5° 7° |
类似零件编号 - EPM7064B |
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类似说明 - EPM7064B |
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