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TDZ6V8J 数据表(PDF) 1 Page - NXP Semiconductors |
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TDZ6V8J 数据表(HTML) 1 Page - NXP Semiconductors |
1 / 12 page 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits 1.3 Applications General regulation functions 1.4 Quick reference data [1] Pulse test: tp 300 s; 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 16 mm2. 2. Pinning information [1] The marking bar indicates the cathode. TDZxJ series Single Zener diodes Rev. 2 — 29 July 2011 Product data sheet Non-repetitive peak reverse power dissipation: 180 W Low differential resistance Total power dissipation: 500 mW AEC-Q101 qualified Very small plastic package suitable for surface-mounted design Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF =100 mA [1] -- 1.1 V Ptot total power dissipation Tamb 25 C [2] -- 500 mW Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 2 anode 2 1 006aaa152 2 1 |
类似零件编号 - TDZ6V8J |
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类似说明 - TDZ6V8J |
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