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MT47H512M4 数据表(PDF) 19 Page - Micron Technology |
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MT47H512M4 数据表(HTML) 19 Page - Micron Technology |
19 / 134 page Figure 9: 84-Ball FBGA Package (9mm x 12.5mm) – x16 Ball A1 ID Seating plane 0.8 ±0.05 Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu). Dimensions apply to solder balls post-reflow on Ø0.35 SMD ball pads. 0.12 A A 12.5 ±0.1 0.8 TYP 1.2 MAX 11.2 CTR Ball A1 ID 0.8 TYP 9 ±0.1 0.25 MIN 6.4 CTR 84X Ø0.45 9 8 7 3 2 1 A B C D E F G H J K L M N P R 1.8 CTR Nonconductive overmold 0.155 Notes: 1. All dimensions are in millimeters. 2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn, 36%Pb, 2% Ag). 2Gb: x4, x8, x16 DDR2 SDRAM Packaging PDF: 09005aef824f87b6 2Gb_DDR2.pdf – Rev. H 10/11 EN 19 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2006 Micron Technology, Inc. All rights reserved. |
类似零件编号 - MT47H512M4 |
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类似说明 - MT47H512M4 |
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