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DAC8811IBDGKT 数据表(PDF) 2 Page - Texas Instruments |
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DAC8811IBDGKT 数据表(HTML) 2 Page - Texas Instruments |
2 / 21 page www.ti.com ABSOLUTE MAXIMUM RATINGS DAC8811 SLAS411B – NOVEMBER 2004 – REVISED FEBRUARY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) MINIMUM RELATIVE DIFFERENTIAL PACKAGE- SPECIFIED TRANSPORT ACCURACY NONLINEARITY LEAD TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) (DESIGNATOR) RANGE MARKING NUMBER QUANTITY DAC8811C ±1 ±1 MSOP-8 (DGK) -40 °C to 85°C D11 DAC8811ICDGKT Tape and Reel, 250 DAC8811C ±1 ±1 MSOP-8 (DGK) -40 °C to 85°C D11 DAC8811ICDGKR Tape and Reel, 2500 DAC8811C ±1 ±1 SON-8 (DRB) -40 °C to 85°C D11 DAC8811ICDRBT Tape and Reel, 250 DAC8811C ±1 ±1 SON-8 (DRB) -40 °C to 85°C D11 DAC8811ICDRBR Tape and Reel, 2500 DAC8811B ±2 ±1 MSOP-8 (DGK) -40 °C to 85°C D11 DAC8811IBDGKT Tape and Reel, 250 DAC8811B ±2 ±1 MSOP-8 (DGK) -40 °C to 85°C D11 DAC8811IBDGKR Tape and Reel, 2500 DAC8811B ±2 ±1 SON-8 (DRB) -40 °C to 85°C D11 DAC8811IBDRBT Tape and Reel, 250 DAC8811B ±2 ±1 SON-8 (DRB) -40 °C to 85°C D11 DAC8811IBDRBR Tape and Reel, 2500 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. over operating free-air temperature range (unless otherwise noted)(1) DAC8811 UNIT VDD to GND –0.3 to 7 V Digital input voltage to GND –0.3 to +VDD + 0.3 V V (IOUT) to GND –0.3 to +VDD + 0.3 V Operating temperature range –40 to 105 °C VREF, RFB to GND –25 to 25 V Storage temperature range –65 to 150 °C Junction temperature range (TJ max) 125 °C Power dissipation (TJ max – TA) / RΘJA W Thermal impedance, RΘJA 55 °C/W Lead temperature, soldering Vapor phase (60s) 215 °C Lead temperature, soldering Infrared (15s) 220 °C ESD rating, HBM 4000 V ESD rating, CDM 1000 V (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback |
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类似说明 - DAC8811IBDGKT |
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