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KMPC8250ACZUMHBC 数据表(PDF) 10 Page - Freescale Semiconductor, Inc |
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KMPC8250ACZUMHBC 数据表(HTML) 10 Page - Freescale Semiconductor, Inc |
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10 / 62 page  MPC8250 Hardware Specifications, Rev. 2 10 Freescale Semiconductor Electrical and Thermal Characteristics 2.2 Thermal Characteristics Table 4 describes thermal characteristics. 2.3 Power Considerations The average chip-junction temperature, TJ, in °C can be obtained from the following: TJ = TA + (PD x θJA) (1) where TA = ambient temperature °C θ JA = package thermal resistance, junction to ambient, °C/W PD = PINT + PI/O PINT = IDD x VDD Watts (chip internal power) PI/O = power dissipation on input and output pins (determined by user) For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ is the following: PD = K/(TJ + 273° C) (2) Solving equations (1) and (2) for K gives: K = PD x (TA + 273° C) + θJA x PD 2 (3) 1 The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. 2 The leakage current is measured for nominal VDD, VCCSYN, and VDD. Table 4. Thermal Characteristics Characteristic Symbol Value Unit Air Flow 480 TBGA 516 PBGA Junction to ambient— single-layer board 1 1 Assumes no thermal vias θJA 13 24 °C/W Natural convection 10 18 1 m/s Junction to ambient— four-layer board 11 16 Natural convection 813 1 m/s Junction to board 2 2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. θJB 48 °C/W — Junction to case 3 3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). θJC 1.1 6 °C/W — |
类似零件编号 - KMPC8250ACZUMHBC |
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类似说明 - KMPC8250ACZUMHBC |
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