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TC1055 数据表(PDF) 3 Page - Microchip Technology |
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TC1055 数据表(HTML) 3 Page - Microchip Technology |
3 / 20 page 2002-2012 Microchip Technology Inc. DS21350E-page 3 TC1054/TC1055/TC1186 Dropout Voltage VIN –VOUT —2 — mV IL = 100 µA —65 — IL = 20 mA —85 120 IL = 50 m TC1055; TC1186 —180 250 IL = 100 mA TC1186 — 270 400 IL = 150 mA (Note 4) Supply Current IIN —50 80 µA SHDN = VIH, IL = 0 µA (Note 9) Shutdown Supply Current IINSD — 0.05 0.5 µA SHDN = 0V Power Supply Rejection Ratio PSRR — 64 — dB f 1kHz Output Short Circuit Current IOUTSC —300 450 mA VOUT = 0V Thermal Regulation VOUT/PD —0.04 — V/W Notes 5, 6 Thermal Shutdown Die Temperature TSD —160 — °C Thermal Shutdown Hysteresis TSD —10 — °C Output Noise eN — 260 — nV/ Hz IL = IOUTMAX SHDN Input SHDN Input High Threshold VIH 45 — — %VIN VIN = 2.5V to 6.5V SHDN Input Low Threshold VIL —— 15 %VIN VIN = 2.5V to 6.5V ERROR Output Minimum VIN Operating Voltage VINMIN 1.0 — — V Output Logic Low Voltage VOL — — 400 mV 1 mA Flows to ERROR ERROR Threshold Voltage VTH —0.95 x VR —V See Figure 4-2 ERROR Positive Hysteresis VHYS —50 — mV Note 7 VOUT to ERROR Delay tDELAY —2.5 — ms VOUT falling from VR to VR – 10% DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN =VOUT +1V, IL =100 µA, CL = 3.3 µF, SHDN >VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 2: 3: Regulation is measured at a constant junction temperature using low-duty-cycle pulse testing. Load regu- lation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipa- tion is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. See Section 5.0 “Thermal Considerations” for more details. 7: Hysteresis voltage is referenced by VR. 8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 9: Apply for junction temperatures of -40°C to +85°C. TC VOUT = (VOUTMAX – VOUTMIN)x 106 VOUT x T |
类似零件编号 - TC1055 |
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类似说明 - TC1055 |
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