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TC1263-3.0VOATR 数据表(PDF) 10 Page - Microchip Technology |
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TC1263-3.0VOATR 数据表(HTML) 10 Page - Microchip Technology |
10 / 18 page TC1263 DS21374D-page 10 2002-2012 Microchip Technology Inc. 5-Lead Plastic (ET) (DDPAK) BOTTOM VIEW TOP VIEW E D b E1 D2 A A1 c2 c L D1 e θ1 θ (5X) L3 1 § Significant Characteristic Drawing No. C04-012 Notes: Mold Draft Angle Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. θ1 7° Pitch Number of Pins Overall Width Standoff § Molded Package Length Exposed Pad Width Overall Height MAX Units Dimension Limits A1 E1 D E e A .398 .000 .256 REF INCHES* .067 BSC MIN 5 NOM MAX .010 0.00 10.11 6.50 REF MILLIMETERS .183 MIN 5 1.70 BSC NOM 0.25 4.65 JEDEC equivalent: TO-252 4.50 .170 .005 0.13 Foot Length L .068 .089 .110 1.73 2.26 2.79 Foot Angle θ -- -- 8° .177 *Controlling Parameter 4.32 .385 .410 9.78 10.41 .330 .350 .370 8.38 8.89 9.40 Overall Length D1 .549 .577 .605 13.94 14.66 15.37 Lead Thickness c .014 .020 .026 0.36 0.51 0.66 Pad Thickness c2 .045 -- .055 1.14 -- 1.40 Lead Width .037 b .026 .032 0.66 0.81 0.94 3° -- 8° 7° 3° -- -- -- Exposed Pad Length D2 .303 REF 7.75 REF Pad Length L3 .045 -- .067 1.14 -- 1.70 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging |
类似零件编号 - TC1263-3.0VOATR |
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类似说明 - TC1263-3.0VOATR |
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